International Display Workshops General Incorporated Association

[AMDp2-3] Hot Implantation Method for Oxide Semiconductor Resistance Control Technique

*Yuya Yamane1, Keisuke Yasuta1, Toshimasa Ui1, Junichi Tatemichi1 (1. Nissin Ion Equipment Co., Ltd (Japan))

Hot implantation, IGZO, Resistance

https://doi.org/10.36463/idw.2023.0282

As a next-generation device process, Hot implantation method for oxide semiconductor resistance control technique were investigated. We carried out investigation of hot implantation in a-IGZO film on glass structure. As a result, we find a-IGZO sheet resistance drastically decrease and implantation process window enhancement.