Micro Bumps by Gravure Offset Printing Method

Shunichi Haraguchi

doi:https://doi.org/10.36463/idw.2023.0352

11:10 〜 11:30

[FMC5-2] Micro Bumps by Gravure Offset Printing Method

*Shunichi Haraguchi¹, Chisato Oyama¹, Kotarou Usuda¹, Yoshihiro Ohyama¹, Hideki Ikeda¹ (1. Komori Corporation (Japan))

Solder Joint, Printed-Electronics, micro LED, Gravure-offset-printing

https://doi.org/10.36463/idw.2023.0352

Gravure offset printing succeeded in forming solder bumps with a minimum diameter of 6 μm within 5% errors. We obtained a design formula to optimize the cell shape of a gravure plate. Wider opening shape is especially suitable when the hole diameter of cell is φ10 μm or less.

Proceedings of the International Display Workshops Volume 30 (IDW '23)

[FMC5-2] Micro Bumps by Gravure Offset Printing Method