11:50 AM - 12:10 PM
[FMC5-4] Fine Patterning of Cu and NiTi Metal Electrode by Reactive Proton Assisted Etching, with Application to High Resolution Stretchable AMOLED/AMLED
High Resolution, Stretchable, Copper, Nitinol, Dry Etching
A fine patterning process is proposed for fabricating lower resistance-higher elastic bus-lines on stretchable TFT backplanes. The process involves the use of multi-layered electrodes comprising highly conductive Cu and super-elastic NiTi thin films, with line widths of <1 µm. To achieve precise and clean dry etching of these metal bus-lines, a novel dry etching process is developed, employing reactive proton assistance reaction at 50 ℃