[A-1-3] A Subnanosecond Masterslice LSI using Dielectric Isolation and Three Layer Metallization Technologies

Tsunehachi Ishitani、Hideo Kodama、Tsuneta Sudo (1.Musashino Electrical Communication Laboratory / Nippon Tel.-Tel. Public Corp.)

https://doi.org/10.7567/SSDM.1977.A-1-3