[S-II-8] Mo-Silicides Bias-Sputtering and Its Application to Thermally-Stable, Via-Hole-Filled Contact Formation

T. MOGAMI, H. OKABAYASHI, K. KAJIYANA, K. UDA, M. MORIMOTO, H. HOSHINO (1.Microelectronics Res. Labs. and Resources & Environ. Prot. Res. Labs., NEC Corporation)

https://doi.org/10.7567/SSDM.1987.S-II-8