[C-3-5] High Rate Reactive Ion Etching of Copper Films in SiCl4, N2, Cl2 and NH3 Mixture

Kazuhide Ohno, Masaaki Sato, Yoshinobu Arita (1.NTT LSI Laboratories)

https://doi.org/10.7567/SSDM.1990.C-3-5