[C-3-7] Encapsulation of Surface Impurities by Silicon Wafer-Bonding

T. Abe, A. Uchiyama, K. Yoshizawa, Y. Nakazato, M. Miyawaki, T. Ohmi (1.Shin-Etsu Handotai, 2.Nagano Denshi, 3.Eng. Dept., Tohoku University)

https://doi.org/10.7567/SSDM.1990.C-3-7