[C-3-7] Encapsulation of Surface Impurities by Silicon Wafer-Bonding

T. Abe、A. Uchiyama、K. Yoshizawa、Y. Nakazato、M. Miyawaki、T. Ohmi (1.Shin-Etsu Handotai、2.Nagano Denshi、3.Eng. Dept., Tohoku University)

https://doi.org/10.7567/SSDM.1990.C-3-7