[D-8-6] High-Speed Heat Removal for VLSI Using AIN Heat-Spreading Layer and Microchannel Fin

Kazuo TSUBOUCHI、Satoshi UTSUGI、Tomoshi FUTATSUYA、Nobuo MIKOSHIBA (1.Research Institute of Electrical Communication, Tohoku University)

https://doi.org/10.7567/SSDM.1990.D-8-6