[S-CI-12] Silicon Wafer-Bonding Process Technology for SOI Structures

T. Abe, M. Nakano, T. Itho, T. Takei, A. Uchiyama, K. Yoshizawa, Y. Nakazato (1.Shin-Etsu Handotai, 2.Nagano Denshi)

https://doi.org/10.7567/SSDM.1990.S-CI-12