[S-CI-12] Silicon Wafer-Bonding Process Technology for SOI Structures

T. Abe、M. Nakano、T. Itho、T. Takei、A. Uchiyama、K. Yoshizawa、Y. Nakazato (1.Shin-Etsu Handotai、2.Nagano Denshi)

https://doi.org/10.7567/SSDM.1990.S-CI-12