Advanced Plasma Processing Equipment without Wafer Surface Damage and Chamber Material Contamination

Haruhiro Goto; Makoto Sasaki; Tadahiro Ohmi; Tadashi Shibata; Atsushi Yamagami; Nobuyuki Okamura; Osamu Kamiya

doi:https://doi.org/10.7567/SSDM.1990.S-F-22

[S-F-22] Advanced Plasma Processing Equipment without Wafer Surface Damage and Chamber Material Contamination

Haruhiro Goto、Makoto Sasaki、Tadahiro Ohmi、Tadashi Shibata、Atsushi Yamagami、Nobuyuki Okamura、Osamu Kamiya (1.Department of Electronics, Faculty of Engineering, Tohoku University、2.Thin Film Technology Div., Canon Inc.)

https://doi.org/10.7567/SSDM.1990.S-F-22

1990 International Conference on Solid State Devices and Materials

[S-F-22] Advanced Plasma Processing Equipment without Wafer Surface Damage and Chamber Material Contamination