A New Cracking Phenomena of Thin Si3N4 Film due to Stress from Poly-Si Grain Growth

1992 International Conference on Solid State Devices and Materials

Aug 26, 1992 - Aug 28, 1992
Tsukuba Center Building, Tsukuba, Japan

Masahiro ITOH, Nobuhiko INOUE, Norio HIRASHITA, Masaki YOSHIMARU (1.Oki Electric Industry Co., Ltd., VLSI Research and Development Center)