[PD3-3] A New Cracking Phenomena of Thin Si3N4 Film due to Stress from Poly-Si Grain Growth

Masahiro ITOH、Nobuhiko INOUE、Norio HIRASHITA、Masaki YOSHIMARU (1.Oki Electric Industry Co., Ltd., VLSI Research and Development Center)

https://doi.org/10.7567/SSDM.1992.PD3-3