[PC-1-16] Al(111)/CVD-TiN(111) Stacked Film Formation Technique with High Aspect-Ratio Contact Hole Filling for Highly Reliable Interconnects

T. Kaizuka、H. Shinriki、N. Takeyasu、T. Ohta (1.LSI Research Center, Kawasaki Steel Corporation)

https://doi.org/10.7567/SSDM.1993.PC-1-16