[PC-1-17] A Highly Reliable Interconnection with Collimated Sputtering of Barrier Layer and High Temperature Sputtering of Al Alloy on Silicide Junction

Y. Takegawa、H. Kotaki、K. Mitsuhashi、J. Takagi、T. Ushiro、Y. Akagi (1.Central Research Laboratories, Research and Analysis Center, Sharp Corporation)

https://doi.org/10.7567/SSDM.1993.PC-1-17