Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy

S. Tokitoh; H. Uchida; Y. Okuno; K. Fushimi; G. Liu; Y. Sakaya; N. Hirashita

doi:https://doi.org/10.7567/SSDM.1994.C-10-3

1994 International Conference on Solid State Devices and Materials

1994年8月23日〜 1994年8月26日
Pacifico Yokohama, Yokohama, Japan

[C-10-3] Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy

S. Tokitoh、H. Uchida、H. Uchida、Y. Okuno、K. Fushimi、G. Liu、Y. Sakaya、N. Hirashita (1.VLSI Research and Development Center, Process Technology Center OKI Electric Industry Co., Ltd.)

https://doi.org/10.7567/SSDM.1994.C-10-3

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