Ammonium Salt Added Silica Slurry for Chemical Mechanical Polishing (CMP) of Interlayer Dielectric Film

Y. Hayashi; M. Sakurai; T. Nakajima; K. Hayashi; S. Sasaki; S. Chikaki; T. Kunio

doi:https://doi.org/10.7567/SSDM.1994.C-11-2

1994 International Conference on Solid State Devices and Materials

Aug 23, 1994 - Aug 26, 1994
Pacifico Yokohama, Yokohama, Japan

[C-11-2] Ammonium Salt Added Silica Slurry for Chemical Mechanical Polishing (CMP) of Interlayer Dielectric Film

Y. Hayashi, M. Sakurai, T. Nakajima, K. Hayashi, S. Sasaki, S. Chikaki, T. Kunio (1.Microelectronics Research Laboratories, Microcomputer Division, NEC)

https://doi.org/10.7567/SSDM.1994.C-11-2

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