[PD-1-5] Al-Reflow Process with a "Cap-Clamp" for Sub-Micron Contact Holes

G. H. Choi、C. S. Park、I. S. Park、S. I. Lee、S. T. Ahn、Y. K. Kim、R. Reynolds (1.Semiconductor R & D Center Samsung Electronics、2.Varian Associates)

https://doi.org/10.7567/SSDM.1994.PD-1-5