[PD-1-5] Al-Reflow Process with a "Cap-Clamp" for Sub-Micron Contact Holes

G. H. Choi, C. S. Park, I. S. Park, S. I. Lee, S. T. Ahn, Y. K. Kim, R. Reynolds (1.Semiconductor R & D Center Samsung Electronics, 2.Varian Associates)

https://doi.org/10.7567/SSDM.1994.PD-1-5