[A-6-2] WSiN Diffusion Barrier Formed by ECR Plasma Nitridation for Copper Damascene Interconnection

A. Hirata、K. Machida、N. Awaya、H. Kyuragi、M. Maeda (1.NTT System Electronics Laboratories)

https://doi.org/10.7567/SSDM.1998.A-6-2