[A-6-2] WSiN Diffusion Barrier Formed by ECR Plasma Nitridation for Copper Damascene Interconnection

A. Hirata, K. Machida, N. Awaya, H. Kyuragi, M. Maeda (1.NTT System Electronics Laboratories)

https://doi.org/10.7567/SSDM.1998.A-6-2