Fluoropolymer and Aerogel Thin Films as Low Dielection in IC Metallization

S. E. Schulz; A. Bertz; R. Streiter; M. Uhlig; U. Weiss; T. Werner; T. Winkler; T. Gessner

doi:https://doi.org/10.7567/SSDM.1998.A-6-4

1998 International Conference on Solid State Devices and Materials

1998年9月7日〜 1998年9月10日
International Conference Center Hiroshima, Hiroshima, Japan

[A-6-4] Fluoropolymer and Aerogel Thin Films as Low Dielection in IC Metallization

S. E. Schulz、A. Bertz、R. Streiter、M. Uhlig、U. Weiss、T. Werner、T. Winkler、T. Gessner (1.Center of Microtechnologies, Chemnitz University of Technology)

https://doi.org/10.7567/SSDM.1998.A-6-4

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