Fluoropolymer and Aerogel Thin Films as Low Dielection in IC Metallization

S. E. Schulz; A. Bertz; R. Streiter; M. Uhlig; U. Weiss; T. Werner; T. Winkler; T. Gessner

doi:https://doi.org/10.7567/SSDM.1998.A-6-4

1998 International Conference on Solid State Devices and Materials

Sep 7, 1998 - Sep 10, 1998
International Conference Center Hiroshima, Hiroshima, Japan

[A-6-4] Fluoropolymer and Aerogel Thin Films as Low Dielection in IC Metallization

S. E. Schulz, A. Bertz, R. Streiter, M. Uhlig, U. Weiss, T. Werner, T. Winkler, T. Gessner (1.Center of Microtechnologies, Chemnitz University of Technology)

https://doi.org/10.7567/SSDM.1998.A-6-4

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