[A-6-6] Thermal and Bias-Temperature Stress Induced Leakage Current Failure of Cu/BCB Single Damascene Integration

Sang U. Kim、Taiheui Cho、Paul Ho (1.Advanced Technology, SEMATECH、2.Intel Corporation、3.U of Texas, Material Science and Eng)

https://doi.org/10.7567/SSDM.1998.A-6-6