A New Approach of Photonic Bandgap Formation -Wafer Bonding and Delamination Technique-

K. Wada; H. Aga; K. Mitani; T. Abe; M. Suezawa; L. C. Kimerling

doi:https://doi.org/10.7567/SSDM.1998.D-6-6

1998 International Conference on Solid State Devices and Materials

1998年9月7日〜 1998年9月10日
International Conference Center Hiroshima, Hiroshima, Japan

[D-6-6] A New Approach of Photonic Bandgap Formation -Wafer Bonding and Delamination Technique-

K. Wada、H. Aga、K. Mitani、T. Abe、M. Suezawa、L. C. Kimerling (1.Department of Materials Science, Massachusetts Institute of Technology、2.Shin-Etsu Handotai、3.Institute of Materials Research, Tohoku University)

https://doi.org/10.7567/SSDM.1998.D-6-6

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