[B-5-2] Electromigration and Thermal Strains in Cu and Al Metallization Features Determined through x-ray Microdiffraction
I. C. Noyan, P.-C. Wang, S. K. Kaldor, J. Jordan-Sweet
(1.International Business Machines Corp., Research Division T. J. Watson Laboratory, 2.International Business Machines Corp., Microelectronics Division)
https://doi.org/10.7567/SSDM.1999.B-5-2