Electromigration and Thermal Strains in Cu and Al Metallization Features Determined through x-ray Microdiffraction

I. C. Noyan; P.-C. Wang; S. K. Kaldor; J. Jordan-Sweet

doi:https://doi.org/10.7567/SSDM.1999.B-5-2

[B-5-2] Electromigration and Thermal Strains in Cu and Al Metallization Features Determined through x-ray Microdiffraction

I. C. Noyan、P.-C. Wang、S. K. Kaldor、J. Jordan-Sweet (1.International Business Machines Corp., Research Division T. J. Watson Laboratory、2.International Business Machines Corp., Microelectronics Division)

https://doi.org/10.7567/SSDM.1999.B-5-2

1999 International Conference on Solid State Devices and Materials

[B-5-2] Electromigration and Thermal Strains in Cu and Al Metallization Features Determined through x-ray Microdiffraction