[B-5-4] Inter-Layer Dielectric Reliability on 1GDRAM with COB Structure

D. H. Kim、B. C. Kim、M. K. Bae、S. C. Lee、J. W. Nam、T. K. KIM、J. S. Kim、Y. J. Park、J. W. Park (1.Semiconductor R&D Center, Samsung Electronics Co., Ltd.)

https://doi.org/10.7567/SSDM.1999.B-5-4