[B-5-4] Inter-Layer Dielectric Reliability on 1GDRAM with COB Structure

D. H. Kim, B. C. Kim, M. K. Bae, S. C. Lee, J. W. Nam, T. K. KIM, J. S. Kim, Y. J. Park, J. W. Park (1.Semiconductor R&D Center, Samsung Electronics Co., Ltd.)

https://doi.org/10.7567/SSDM.1999.B-5-4