[E-15-3] Development of the Three-Dimensional Integration Technology for Highly Parallel Image Processing Chip

K. W. Lee、T. Nakamura、H. Hashimoto、K. Sakuma、K. T. Park、N. Miyakawa、H. Itani、H. Kurino、M. Koyanagi (1.Dept. of Machine Intelligence and System Engineering, Tohoku University、2.Fuji Xerox Co.、3.Mitsubishi Heavy Industry Co.)

https://doi.org/10.7567/SSDM.1999.E-15-3