Organic Substrate and Flip-Chip Bonding on It Technology, &quot;Chip on ALIVH&quot; Suitable for GHz System Packaging

Yutaka Taguchi; Hideki Iwaki; Minehiro Itagaki; Yoshihiro Bessho; Kazuo Eda

doi:https://doi.org/10.7567/SSDM.1999.E-16-1

1999 International Conference on Solid State Devices and Materials

1999年9月21日〜 1999年9月24日
Nihon Toshi Center Kaikan, Tokyo, Japan

[E-16-1] Organic Substrate and Flip-Chip Bonding on It Technology, "Chip on ALIVH" Suitable for GHz System Packaging

Yutaka Taguchi、Hideki Iwaki、Minehiro Itagaki、Yoshihiro Bessho、Kazuo Eda (1.Matsushita Electric Industrial Co., Ltd., Device Engineering Development Center)

https://doi.org/10.7567/SSDM.1999.E-16-1

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