Organic Substrate and Flip-Chip Bonding on It Technology, &quot;Chip on ALIVH&quot; Suitable for GHz System Packaging

Yutaka Taguchi; Hideki Iwaki; Minehiro Itagaki; Yoshihiro Bessho; Kazuo Eda

doi:https://doi.org/10.7567/SSDM.1999.E-16-1

1999 International Conference on Solid State Devices and Materials

Sep 21, 1999 - Sep 24, 1999
Nihon Toshi Center Kaikan, Tokyo, Japan

[E-16-1] Organic Substrate and Flip-Chip Bonding on It Technology, "Chip on ALIVH" Suitable for GHz System Packaging

Yutaka Taguchi, Hideki Iwaki, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda (1.Matsushita Electric Industrial Co., Ltd., Device Engineering Development Center)

https://doi.org/10.7567/SSDM.1999.E-16-1

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