[A-1-5] Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization

Shui Jinn Wang、Hao Yi Tsai、S. C. Sun (1.Microelectronics Lab., Dept. of Electrical Engineering, National Cheng Kung University、2.R&D, Wafertech)

https://doi.org/10.7567/SSDM.2000.A-1-5