[A-2-6] Evaluation of PECVD a-SiC:H as a Cu Diffusion Barrier Layer of Cu Dual Damascene Process

Soo Gun Lee、Hyeok-Sang Oh、Hong-Jae Shin、Jin-Gi Hong、Hyeon-Deok Lee、Hokyu Kang (1.Process Development Team, Semiconductor R&D center, Samsung Electronics)

https://doi.org/10.7567/SSDM.2000.A-2-6