Dishing-Free Cu Chemical Mechanical Polishing Process Based on Endpoint Detection with Laser Beam

Y. Tokuyama; H. Ogawa; M. Yanagisawa; J. Kikuchi; H. Nakagawa; Y. Horiike

doi:https://doi.org/10.7567/SSDM.2001.A-1-4

[A-1-4] Dishing-Free Cu Chemical Mechanical Polishing Process Based on Endpoint Detection with Laser Beam

Y. Tokuyama, H. Ogawa, M. Yanagisawa, J. Kikuchi, H. Nakagawa, Y. Horiike (1.Department of Materials Science, School of Engineering, The University of Tokyo, 2.Speedfam Co., Ltd., 3.Axiomatec Inc., 4.Semiconductor Company, Matsushita Electric Industrial Co., Ltd)

https://doi.org/10.7567/SSDM.2001.A-1-4

2001 International Conference on Solid State Devices and Materials

[A-1-4] Dishing-Free Cu Chemical Mechanical Polishing Process Based on Endpoint Detection with Laser Beam