Development of New Tight-Binding Molecular Dynamics Program to Simulate Chemical-Mechanical Polishing Processes

Toshiyuki Yokosuka; Hitoshi Kurokawa; Seiichi Takami; Momoji Kubo; Akira Miyamoto; Akira Imamura

doi:https://doi.org/10.7567/SSDM.2001.P-1-13

[P-1-13] Development of New Tight-Binding Molecular Dynamics Program to Simulate Chemical-Mechanical Polishing Processes

Toshiyuki Yokosuka, Hitoshi Kurokawa, Seiichi Takami, Momoji Kubo, Akira Miyamoto, Akira Imamura (1.Department of Materials Chemistry, Graduated School of Engineering, Tohoku University, 2.Department of Mathematics, Faculty of Engineering, Hiroshima Kokusai Gakuin University)

https://doi.org/10.7567/SSDM.2001.P-1-13

2001 International Conference on Solid State Devices and Materials

[P-1-13] Development of New Tight-Binding Molecular Dynamics Program to Simulate Chemical-Mechanical Polishing Processes