[P-1-7] Investigation of Interconnect Temperature Rise due to Joule Heating and Its Effect on Electromigration Reliability
S. Miyazaki, H. Sakaue, S. Shingubara, T. Takahagi
(1.Hiroshima University, Graduate School of ADSM)
https://doi.org/10.7567/SSDM.2001.P-1-7
