[F-1-4] Bonding Process for Nano-Scale Wiring using Carbon Nano-Tube by Scanning Tunneling Microscope Tip

N. Aoki, J. Takayama, M. Kida, K. Horiuchi, S. Yamada, T. Ida, K. Ishibashi, Y. Ochiai (1.Department of Materials Technology & Center for Frontier Electronics and Photonics, Chiba University, 2.Corporate Research Center, Fuji-Xerox Co. Ltd., 3.School of Materials Science, Japan Advanced Institute of Science and Technology (JAIST), 4.Semiconductor Laboratory, RIKEN)

https://doi.org/10.7567/SSDM.2002.F-1-4