[F-1-4] Bonding Process for Nano-Scale Wiring using Carbon Nano-Tube by Scanning Tunneling Microscope Tip

N. Aoki、J. Takayama、M. Kida、K. Horiuchi、S. Yamada、T. Ida、K. Ishibashi、Y. Ochiai (1.Department of Materials Technology & Center for Frontier Electronics and Photonics, Chiba University、2.Corporate Research Center, Fuji-Xerox Co. Ltd.、3.School of Materials Science, Japan Advanced Institute of Science and Technology (JAIST)、4.Semiconductor Laboratory, RIKEN)

https://doi.org/10.7567/SSDM.2002.F-1-4