[F-3-3] Behavior of Plated Micro-Bumps during Ultrasonic Flip-Chip Bonding Determined from Dynamic Strain Measurement

Naoya Watanabe、Tanemasa Asano (1.Center for Microelectronic Systems, Kyushu Institute of Technology)

https://doi.org/10.7567/SSDM.2002.F-3-3