[F-5-2] STP Sealing Technique for Surface Micromachined MEMS Stacked on a CMOS LSI

N. Sato, H. Ishii, S. Shigematsu, H. Morimura, K. Kudou, M. Yano, K. Machida (1.NTT Telecommunications Energy Labs., NTT Lifestyle and Environmental Technology Labs., NTT Corporation, 2.NTT Advanced Technology Corporation)

https://doi.org/10.7567/SSDM.2002.F-5-2