[F-5-2] STP Sealing Technique for Surface Micromachined MEMS Stacked on a CMOS LSI

N. Sato、H. Ishii、S. Shigematsu、H. Morimura、K. Kudou、M. Yano、K. Machida (1.NTT Telecommunications Energy Labs., NTT Lifestyle and Environmental Technology Labs., NTT Corporation、2.NTT Advanced Technology Corporation)

https://doi.org/10.7567/SSDM.2002.F-5-2