Au Bump Interconnection with Ultrasonic Flip-chip Bonding in 20μm pitch

Kazumasa Tanida; Mitsuo Umemoto; Ryoichi Kajiwara; Yoshihiro Tomita; Yukiharu Akiyama; Kenji Takahashi

doi:https://doi.org/10.7567/SSDM.2002.LC-1-1

[LC-1-1] Au Bump Interconnection with Ultrasonic Flip-chip Bonding in 20μm pitch

Kazumasa Tanida, Mitsuo Umemoto, Ryoichi Kajiwara, Yoshihiro Tomita, Yukiharu Akiyama, Kenji Takahashi (1.Association of Super-Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center)

https://doi.org/10.7567/SSDM.2002.LC-1-1

2002 International Conference on Solid State Devices and Materials

[LC-1-1] Au Bump Interconnection with Ultrasonic Flip-chip Bonding in 20μm pitch