A New Microwave-Excited Plasma Etching Equipment separated Plasma Excited Region from Etching Process Region

Tetsuya Goto; Masaki Hirayama; Makoto Moriguchi; Shigetoshi Sugawa; Tadahiro Ohmi

doi:https://doi.org/10.7567/SSDM.2002.P3-13

[P3-13] A New Microwave-Excited Plasma Etching Equipment separated Plasma Excited Region from Etching Process Region

Tetsuya Goto、Masaki Hirayama、Makoto Moriguchi、Shigetoshi Sugawa、Tadahiro Ohmi (1.New Industry Creation Hatchery Center, Tohoku University、2.Graduate School of Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2002.P3-13

2002 International Conference on Solid State Devices and Materials

[P3-13] A New Microwave-Excited Plasma Etching Equipment separated Plasma Excited Region from Etching Process Region