Quantum Chemical Molecular Dynamics Studies on the Chemical Mechanical Polishing Process of Cu Surface

Toshiyuki Yokosuka; Katsumi Sasata; Hitoshi Kurokawa; Seiichi Takami; Momoji Kubo; Akira Imamura; Akira Miyamoto

doi:https://doi.org/10.7567/SSDM.2002.P3-16

[P3-16] Quantum Chemical Molecular Dynamics Studies on the Chemical Mechanical Polishing Process of Cu Surface

Toshiyuki Yokosuka, Katsumi Sasata, Hitoshi Kurokawa, Seiichi Takami, Momoji Kubo, Akira Imamura, Akira Miyamoto (1.Department of Materials Chemistry, Graduate School of Engineering, Tohoku University, 2.Hiroshima Kokusai Gakuin University, 3.New Industry Creation Hatchery Center, Tohoku University)

https://doi.org/10.7567/SSDM.2002.P3-16

2002 International Conference on Solid State Devices and Materials

[P3-16] Quantum Chemical Molecular Dynamics Studies on the Chemical Mechanical Polishing Process of Cu Surface