[C-5-2] Mechanical property control of Low-k Dielectrics for Diminishing CMP-related Defects in Cu-damascene Interconnects

K. Hijioka、F. Ito、M. Tagami、H. Ohtake、T. Takeuchi、S. Saitoh、Y. Hayashi (1.Silicon Systems Research Laboratories, NEC Corporation)

https://doi.org/10.7567/SSDM.2003.C-5-2