High-modulus Porous MSQ Films for Cu/Low-k Integration (keff &lt; 2.7)

K. Misawa; S. Sone; H.J. Shin; K. Inukai; Y. Sudo; S. Kondo; B.U. Yoon; S. Tokitoh; K. Yoneda; T. Yoshie; N. Ohashi; N. Kobayashi

doi:https://doi.org/10.7567/SSDM.2003.C-6-1

2003 International Conference on Solid State Devices and Materials

2003年9月16日〜 2003年9月18日
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[C-6-1] High-modulus Porous MSQ Films for Cu/Low-k Integration (keff < 2.7)

K. Misawa、S. Sone、H.J. Shin、K. Inukai、Y. Sudo、S. Kondo、B.U. Yoon、S. Tokitoh、K. Yoneda、T. Yoshie、N. Ohashi、N. Kobayashi (1.Research Dept. 2, Semiconductor Leading Edge Technologies, Inc. (Selete))

https://doi.org/10.7567/SSDM.2003.C-6-1

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