High-modulus Porous MSQ Films for Cu/Low-k Integration (keff &lt; 2.7)

K. Misawa; S. Sone; H.J. Shin; K. Inukai; Y. Sudo; S. Kondo; B.U. Yoon; S. Tokitoh; K. Yoneda; T. Yoshie; N. Ohashi; N. Kobayashi

doi:https://doi.org/10.7567/SSDM.2003.C-6-1

2003 International Conference on Solid State Devices and Materials

Sep 16, 2003 - Sep 18, 2003
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[C-6-1] High-modulus Porous MSQ Films for Cu/Low-k Integration (keff < 2.7)

K. Misawa, S. Sone, H.J. Shin, K. Inukai, Y. Sudo, S. Kondo, B.U. Yoon, S. Tokitoh, K. Yoneda, T. Yoshie, N. Ohashi, N. Kobayashi (1.Research Dept. 2, Semiconductor Leading Edge Technologies, Inc. (Selete))

https://doi.org/10.7567/SSDM.2003.C-6-1

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