Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida; Mitsuo Umemoto; Naotaka Tanaka; Yoshihiro Tomita; Kenji Takahashi

doi:https://doi.org/10.7567/SSDM.2003.G-4-2

2003 International Conference on Solid State Devices and Materials

Sep 16, 2003 - Sep 18, 2003
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[G-4-2] Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Naotaka Tanaka, Yoshihiro Tomita, Kenji Takahashi (1.Association of Super -Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center)

https://doi.org/10.7567/SSDM.2003.G-4-2

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